| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5014200 | Engineering Fracture Mechanics | 2016 | 10 Pages |
Abstract
Interfacial fatigue crack characterization is challenging for as-deposited thin films due to issues with fixturing and precision application of cyclic loading. A fixtureless and microfabricated test technique is presented to characterize delamination propagation rate as a function of constant amplitude fatigue loading using a novel peel test configuration and magnetic actuation. The test was demonstrated for 1.6 μm thick Cu films on a Si substrate, where interfacial fatigue crack propagation was observed to follow Paris Law behavior.
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Authors
Gregory T. Ostrowicki, Suresh K. Sitaraman,