Assessing quality of diffusion bonded joints with interlayer using ultrasonic/ultrasound

The reflection of echo from interface, area fraction bonded and 'C' scan image obtained from ultrasonic 'C' scan show an estimate of the bond quality. The observed parameters were correlated with the destructive test to calibrate the ultrasonic parameters. The mechanism of bonding is determined by the grain growth equation. The bond interface and bonded samples were analysed using optical and scanning electron microscopy (SEM). The chemical composition of the fractured and bonded area is determined using the Energy Dispersive Spectrometry (EDS). It is established that the ultrasonic 'C' scan can be employed for regular inspection of diffusion bonding joints, made with interlayer.