Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5018014 | Journal of Materials Processing Technology | 2017 | 8 Pages |
Abstract
Large area seals were prepared between a metal foil frame (Fe-Ni alloy with 48Â wt% Ni) and a 901Â ÃÂ 814Â mm2 glass pane through the simultaneous application of activated liquid tin solder anodic bonding and soft soldering. An experimental facility including a liquid solder injector was built. Prototype seals were produced with tin solder alloys with variable Al contents and the hermiticity and interface integrity was determined. Solder alloys with an Al content of 112.5Â ppm resulted in the strongest adhesion forces, broadly consistent with a previous study at the laboratory scale. The resulting prototypes consist of a bonded area of â¼450Â cm2 along the perimeter of a 0.73Â m2 glass pane and display consistently strong bonds for sections over a meter in length, demonstrating that activated liquid solder anodic bonding is not restricted to small-area applications.
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Physical Sciences and Engineering
Engineering
Industrial and Manufacturing Engineering
Authors
Ernesto Claure Ramirez, Robert KlemenÄiÄ, Martin KluÄka, Britta Lang, Samuel Beisel, Heinz Altorfer, Matthias M. Koebel, Wim J. Malfait,