Interfacial fracture analysis of bonded dissimilar strips with a functionally graded interlayer under antiplane deformation

This paper provides the solution to the problem of dissimilar, homogeneous semi-infinite strips bonded through a functionally graded interlayer and weakened by an embedded or edge interfacial crack. The bonded system is assumed to be under antiplane deformation, subjected to either traction-free or clamped boundary conditions along its bounding planes. Based on the Fourier integral transform, the problem is formulated in terms of a singular integral equation which has a simple Cauchy kernel for the embedded crack and a generalized Cauchy kernel for the edge crack. In the numerical results, the effects of geometric and material parameters of the bonded system on the crack-tip stress intensity factors are presented in order to quantify the interfacial fracture behavior in the presence of the graded interlayer.