Selective metallization on copper aluminate composite via laser direct structuring technology

This study focused on synthesizing copper aluminate and the compound's applicability to laser direct structuring technology. Since aluminum weighs less and costs less than chromium, this study investigated its potential as a substitute in copper chromate, the main additive of LDS materials. Copper aluminate was synthesized using a sol-gel method. The synthesized powder was then applied to two types of resin, polycarbonate (thermoplastic) and polyimide (thermosetting). After optimum processing at each laser parameter, the metal patterns are formed by electroless plating. Fabricated patterns were observed using optical microscopy. This study confirmed that copper aluminate can be used in LDS (Laser direct structuring) technology and that, furthermore, it supports the formation of conductive patterns with both thermoplastic and thermosetting resins.