BN@PPS core-shell structure particles and their 3D segregated architecture composites with high thermal conductivities

Hexagonal boron nitride (h-BN) presents an excellent thermal conductivity and the outstanding insulating property for electronic packaging. However, a traditional method can enhance the thermal conductivity of the composites by melt mixing fillers and polymers usually leading to composites with limited thermal conductivity. Here, BN@PPS (Polyphenylene sulfide) core-shell structure particles and their composites with the 3D segregated architecture are presented. The composite achieves a high thermal conductivity of 4.15 W/mK containing 40 vol% BN, which is 16 times higher than that of PPS resin of ∼0.25 W/mK and 1.69 times higher than that PPS/BN blend composite with at the same BN loading of 2.45 W/mK. The outstanding thermally conductive property of segregated architecture PPS/BN composite is attributed to the formation of BN flakes networks in the PPS matrices, which can provide effective thermal conductive pathway. This segregated architecture composite is an optimal material for insulating electronic packaging.