Thermal expansion behavior of copper matrix composite containing negative thermal expansion PbTiO3 particles

261PbTiO3/Cu composites were prepared by spark plasma sintering method. The addition of PbTiO3 particles not only effectively reduces but also stabilizes the coefficients of thermal expansion of the composites from room temperature to about 350 °C. The lattice constant and the thermal expansion behavior of PbTiO3 in the composite are studied. The negative and decreasing thermal expansion of PbTiO3 particles suppresses the thermal expansion of Cu matrix with temperature increasing, which leads to low and stable coefficient of thermal expansion of the composite.