| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5023402 | Materials & Design | 2017 | 28 Pages |
Abstract
Schematic diagrams of the microstructure evolution at 450 °C for bondlines based on Cu@Sn particles with thin and thick Sn coating layers.141
Related Topics
Physical Sciences and Engineering
Engineering
Engineering (General)
Authors
Tianqi Hu, Hongtao Chen, Mingyu Li, Chunqing Wang,