Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5128524 | Procedia Manufacturing | 2017 | 8 Pages |
Abstract
We develop wire saws with the diamond grains bonded to the wires for non-slurry cutting process. We invented a special product machine which has a high vacuum furnace and a special solder that contain a metallic compound. In this paper we demonstrate the finest saw wire that is 50 µm of diameter tungsten (W) wires and can perform in cutting an extremely hard material which include the diamond substrate.
Keywords
Related Topics
Physical Sciences and Engineering
Engineering
Industrial and Manufacturing Engineering
Authors
O. Kamiya, H. Mori, M. Ito, M. Takahashi, Y. Miyano, T. Pasang, M. Nakatsu, Y. Iwama,