An Analytical Chip Thickness Model for Performance Assessment in Silicon Carbide Grinding

The chip-thickness models, used to assess the performance of grinding processes, play important role in predicting the surface quality. In the present paper, an attempt has been made to develop a new chip-thickness model for the performance assessment of Silicon Carbide grinding by incorporating the real contact length in the existing basic chip-thickness model. The new model has been validated by conducting experiments, taking the surface roughness as a parameter of evaluation.