Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5150600 | Solid State Ionics | 2017 | 7 Pages |
Abstract
Within thermoelectric generators, the chemical diffusion of a contact material into the active thermoelectric material is a potential cause for degradation, which has rarely been discussed in literature. Frequently, this degradation phenomenon leads to major problems in developing new modules and achieving long-term stability. In this study, copper as one of the standard contact materials and lead telluride as the state-of-the-art active material in the mid-temperature range are investigated. Chemical diffusion experiments of copper in lead telluride were carried out between 375Â K and 795Â K and the copper diffusion profiles were obtained by Secondary Ion Mass Spectrometry (SIMS). The evaluated chemical diffusion coefficient is lower than 10â13Â cm2/s in the respective temperature range.
Related Topics
Physical Sciences and Engineering
Chemistry
Electrochemistry
Authors
C. Schneider, P. Schichtel, B. Mogwitz, M. Rohnke, J. Janek,