| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5185130 | Polymer | 2008 | 5 Pages |
Abstract
A novel epoxy resin containing imide and naphthyl groups was synthesized, and characterized using NMR, NMR, FT-IR spectra and elemental analyses. The curing behavior was investigated with differential scanning calorimetry (DSC) using 4,4â²-diaminodiphenylsulfone (DDS) as curing agent. The physical properties of the cured polymer were evaluated with dynamic thermal mechanical analysis (DMTA) and thermogravimetric analysis (TGA). The results showed that the cured polymer exhibited higher glass transition temperature (Tg) and better thermal stability compared with those commercial available heat resistant epoxy resins.
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Physical Sciences and Engineering
Chemistry
Organic Chemistry
Authors
Hua Ren, Jianzhong Sun, Qian Zhao, Qiyun Zhou, Qincai Ling,