| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5191943 | Polymer | 2005 | 9 Pages |
Abstract
Epoxy/silica composites have been used widely as the electronics packaging materials. This paper tested the thermal properties, moisture absorption and dielectric properties of pure epoxy and epoxy composites with micron-sized silica and nano-sized silica. The master curve of the dielectric loss factor was obtained by time-temperature superposition principle. Results showed that the nano-composite had a much higher loss factor, lower glass transition temperature and higher moisture absorption than other samples. By the analysis of the origin of the dielectric response in epoxy/silica composite, the reason for the different dielectric relaxation behaviors of the nano-composite, the micron-composite, and the pure epoxy was discussed.
Related Topics
Physical Sciences and Engineering
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Authors
Yangyang Sun, Zhuqing Zhang, C.P. Wong,