Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5204374 | Polymer Degradation and Stability | 2006 | 7 Pages |
Abstract
Epoxy resins with different silicon contents were prepared from silicon-containing epoxides or silicon-containing prepolymers by curing with 4,4â²-diaminodiphenylmethane. The reactivity of the silicon-based compounds toward amine curing agents was higher than that of the conventional epoxy resins. The Tg of the resulting thermosets was moderate and decreased when the silicon content increased. The onset decomposition temperatures decreased and the char yields increased when the silicon content increased. Epoxy resins had a high LOI value, according to the efficiency of silicon in improving flame retardance.
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Authors
L.A. Mercado, M. Galià , J.A. Reina,