| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5206123 | Polymer Testing | 2015 | 6 Pages |
Abstract
In the present work, we present an instrumented molding device allowing the production of adhesion peeling test samples under well controlled curing temperature cycles. Tests performed on a model natural rubber compound with a commercial adhesive system show that, for high cure temperatures, the quality of the rubber-to-metal bonding obtained is significantly reduced. The decrease of the peeling energy appears to be inversely proportional to the reversion undergone by the rubber during cure. Such a result points out the necessity of taking into account this phenomenon for optimization of the vulcanization bonding process.
Related Topics
Physical Sciences and Engineering
Chemistry
Organic Chemistry
Authors
Anouar Souid, Alain Sarda, Rémi Deterre, Eric Leroy,