Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5216752 | Tetrahedron | 2013 | 7 Pages |
Abstract
Copper-catalyzed intermolecular C-N bond-forming reactions between aryl iodides and amides are described using sodium ascorbate, which is both cheap and nontoxic, as the additive. A variety of functionalized amides including some practical, unique secondary amides, such as N-arylacrylamides and 4-amido-N-phenylbenzamides, which are difficult to obtain by the classical methods, are prepared. Furthermore, some tertiary amides are prepared by using copper thiophenecarboxylate.
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Related Topics
Physical Sciences and Engineering
Chemistry
Organic Chemistry
Authors
Zheng-Jun Quan, Hai-Dong Xia, Zhang Zhang, Yu-Xia Da, Xi-Cun Wang,