Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5347905 | Applied Surface Science | 2016 | 14 Pages |
Abstract
- Picosecond laser cutting of fragile 150 μm thin germanium wafers (typically used for solar cell applications) in liquid results in debris-free surfaces.
- Liquid-assisted laser cutting is much better than air-assisted laser cutting in terms of recast, debris and cleanness of the resultant grooves.
- Laser cutting in ethanol-water mixtures result in better cut quality than those performed in pure water but lead to less cutting efficiency.
- Low repetition rate (10 kHz), mixed solution (1 wt% ethanol in water) and moderate scanning speed (100 μm/s) are preferable for ultrafine high-quality debris-free cutting.
Keywords
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Dongshi Zhang, Bilal Gökce, Steffen Sommer, René Streubel, Stephan Barcikowski,