Electrodeposition efficiency of Ni in the fabrication of highly ordered nanowire arrays: The roles of Cu pre-plating and barrier layer temperature

- The EE of Ni in the fabrication of NWs embedded in PAO templatewas investigated.
- Using Cu pre-platingand TBL ∼ 24 °C, a steady-state electrodeposition was created.
- Fabrication of uniform 35 nm diameter Ni NWs with a length of 9 μm.
- Enhancement in both the EE and coercivity up to 55% and 1100 Oe atjed of 60  mA/cm2.