| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5349700 | Applied Surface Science | 2015 | 6 Pages |
Abstract
- A thin oxide layer always remains on surfaces of Cu wafers after aqueous etching.
- A pure Cu wafer is obtained by the HAc treatment and the water CA is about 45°.
- The oxide layer and CA grow with time after the Cu wafer is exposed to air.
- Surface roughness and hydrophobicity of pure Cu wafers grow rapidly in vacuum.
Keywords
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Sheng-Hung Tu, Chuan-Chang Wu, Hsing-Chen Wu, Shao-Liang Cheng, Yu-Jane Sheng, Heng-Kwong Tsao,