Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5350055 | Applied Surface Science | 2014 | 5 Pages |
Abstract
The residual stress reduces with a higher pulse repetition rate and the lower residual stress reduces the risk of cracking following the etching process.
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
H.K. Lin, W.C. Hsu,