Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5351876 | Applied Surface Science | 2014 | 7 Pages |
Abstract
The electrodeposition mechanism, microstructures and corrosion resistances of Ni-Cu alloy coatings on Cu substrate were investigated in a choline chloride-urea (1:2 molar ratio) eutectic-based ionic liquid (1:2 ChCl-urea IL) containing nickel and copper chlorides. Cyclic voltammetry showed that the onset reduction potentials for Cu (â¼â0.32 V) and for Ni (â¼â0.47 V) were close to each other, indicating that Ni-Cu co-deposition could be easily achieved in the absence of complexing agent which was indispensable in aqueous plating electrolyte. Chronoamperometric investigations revealed that Ni-Cu deposits followed the three-dimensional instantaneous nucleation/growth mechanism, thus producing a solid solution. The compositions, microstructures and corrosion resistances of Ni-Cu alloy coatings were significantly dependent on the deposition current densities. Ni-Cu alloy coatings were α-Ni(Cu) solid solutions, and the coating containing â¼17.6 at.% Cu exhibited the best corrosion resistance because of its dense and crack-free structure.
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Authors
Shaohua Wang, Xingwu Guo, Haiyan Yang, JiChun Dai, Rongyu Zhu, Jia Gong, Liming Peng, Wenjiang Ding,