Article ID Journal Published Year Pages File Type
5354371 Applied Surface Science 2015 5 Pages PDF
Abstract
We believe that molecular dynamics simulation of the polishing process, possibly also other types of surface treatment, can be based on this model. However influence of material parameters and processing conditions (including plasma characteristics) must be taken into account using appropriate model variables.
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Related Topics
Physical Sciences and Engineering Chemistry Physical and Theoretical Chemistry
Preview
Applicability of random sequential adsorption algorithm for simulation of surface plasma polishing kinetics
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