| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5354428 | Applied Surface Science | 2013 | 7 Pages |
Abstract
⺠We coated silica nanoparticles on glass, polyimide and copper substrates at different concentrations and performed a thermal sintering process for nanoparticles immobilization. ⺠We examined the surface morphologies and surface elements of above mentioned substrates. ⺠We examined the surface wettability of the above mentioned substrates. ⺠Copper surface has a significantly greater contact angle than the other two substrates at the same nanoparticles concentrations. ⺠Nano-roughening of copper surface due to thermal sintering helps to develop hierarchic micro/nanostructures, and is believed contribute to the wettability difference. Such nano-roughened features were not found in glass/polyimide substrates. ⺠Substrate material and the surface preparation approach must be appropriately selected by considering the possible surface topography evolution during surface functionalization and subsequent use.
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Authors
Kang Wei, Hansong Zeng, Yi Zhao,