| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5354749 | Applied Surface Science | 2012 | 6 Pages |
Abstract
⺠Sequential MOCVD of Al and Cu metals. ⺠Process feasibility ensured by appropriate selection of Al and Cu MOCVD precursors. ⺠Al/Cu ratio and annealing temperature drives the nature of Al-Cu phases. ⺠In situ monitored post deposition annealing allows formation of targeted Al-Cu phases.
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Authors
Lyacine Aloui, Thomas Duguet, Fanta Haidara, Marie-Christine Record, Diane Samélor, François Senocq, Dominique Mangelinck, Constantin Vahlas,