Article ID Journal Published Year Pages File Type
5355204 Applied Surface Science 2016 6 Pages PDF
Abstract
Thermal stability of structures (a) Cu/SiO2/Si and (b) Cu/Co/SiO2/Si, indicating that presence of thin cobalt layer improves the thermal stability of the structure up to 600 °C.
Related Topics
Physical Sciences and Engineering Chemistry Physical and Theoretical Chemistry
Authors
, , , ,