| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5355478 | Applied Surface Science | 2011 | 7 Pages |
Abstract
⺠Ti-Cu-N nanocomposite films were deposited by pulse biased arc ion plating. ⺠The Cu content depended on the pulse bias voltage. ⺠The maximum value of hardness reaches 31.5 GPa at â600 V, with Cu content of 1.75 at.%. ⺠The maximum value of adhesion of the film with 74 N was obtained at pulse bias â900 V.
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Authors
Yanhui Zhao, Xueqi Wang, Jinquan Xiao, Baohai Yu, Fengqi Li,