| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5355582 | Applied Surface Science | 2016 | 8 Pages |
Abstract
- The wetting angle of lead free solder on Cu was reduced by surface microstructure.
- The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”.
- The experimental results had a sound fit with the theoretical calculation.
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Haiyan Chen, Jianke Peng, Li Fu, Xincheng Wang, Yan Xie,