| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5355588 | Applied Surface Science | 2016 | 5 Pages |
Abstract
- Current-stressing experiments were performed for a Ag thin-film line on a Si substrate.
- The influence of a hot and humid environment on the thermal transport across the Ag/Si interface was investigated.
- The electrical resistivity of the line increased with the exposure time in the hot and humid environment.
- Interfacial thermal conductance decreased due to the formation of voids within the line.
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Yuan Li, Kyohei Noguchi, Masumi Saka,