| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5355635 | Applied Surface Science | 2012 | 4 Pages |
Abstract
⺠We present a experimental observations of the measurements of the average force per width during deposition and annealing of Au/Cu/Au tri-layers attached to silicon substrate. ⺠We find that one cycle of annealing is sufficient to achieve the thermomechanical stability of the Au/Cu/Au tri-layer systems. ⺠The beginning of deviation from linear part of stress curve can identify the temperature at which plastic deformation processes occurring in materials of the multilayer.
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Authors
Dariusz Chocyk, Adam Proszynski,