| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5355636 | Applied Surface Science | 2012 | 4 Pages |
Abstract
⺠LPCVD, RTCVD and ALD as-deposited nitride films present tensile stress dependant on the Si/N ratio and are thermally stable. ⺠Stress of as-deposited PECVD nitride layers range from compressive to tensile, depending on ion bombardment during growth. ⺠After high temperature annealing, PECVD nitride films behave similarly to LPCVD layers. ⺠Young's moduli and density are positively correlated.
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Authors
Pierre Morin, Gaetan Raymond, Daniel Benoit, Patrick Maury, Remi Beneyton,