| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5355969 | Applied Surface Science | 2012 | 7 Pages |
Abstract
⺠Deposition of Al2O3 films on pure copper by an atomic layer deposition (ALD) technique. ⺠Analysis of properties of the films coated at various substrate temperatures using the ALD technique. ⺠Identification of the improvement of oxidation resistance of pure copper by the ALD-Al2O3 films. ⺠Assessment of the durability of the ALD-Al2O3 films by adhesion strength.
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Authors
M.L. Chang, T.C. Cheng, M.C. Lin, H.C. Lin, M.J. Chen,