| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5356590 | Applied Surface Science | 2015 | 5 Pages |
Abstract
- We propose the PAA-PEG interpolymer complex as a passivation agent for low dishing with high selectivity between SiO2 and Si3N4.
- PAA can form the interpolymer complex with PEG through the H-bonding.
- During the over-polishing step, the cross-linked network structure of the PAA-PEG interpolymer complex prevents abrasives from polishing SiO2 in the trenches, resulting in a significant decrease in dishing.
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Jihoon Seo, Jinok Moon, Sunho Moon, Ungyu Paik,