Article ID Journal Published Year Pages File Type
5356759 Applied Surface Science 2012 5 Pages PDF
Abstract
► Cu-Ni-P coatings with unique architectures were fabricated by electroless deposition. ► The influence of PEG on morphology and structure were investigated. ► Cu-Ni-P coating is hydrophobic with maximum contact angle of 123.8°.
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Related Topics
Physical Sciences and Engineering Chemistry Physical and Theoretical Chemistry
Preview
Influence of PEG molecular weight on morphology, structure and wettability of electroless deposited Cu-Ni-P films
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