| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5357123 | Applied Surface Science | 2012 | 8 Pages |
Abstract
⺠Surface oxide of nanosolders plays a critical role in the melting of solder nanowires and nanorods. ⺠Flux can effectively remove the surface oxide layer and ensure complete nanosolder reflow. ⺠An interesting Ostwald ripening phenomenon was observed during the melting of solder nanowires and nanorods, which led to the formation of nano- and micro-sized solder balls. ⺠The smallest solder balls that we have observed are in the range of tens of nanometer. ⺠A significant shape change (quasi-melting) was observed for these nano-solders at a temperature well below the apparent melting point temperature, which underlines the importance of the solder reflow conditions.
Keywords
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Fan Gao, Karunaharan Rajathurai, Qingzhou Cui, Guangwen Zhou, Irene NkengforAcha, Zhiyong Gu,