| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5357407 | Applied Surface Science | 2012 | 6 Pages |
Abstract
⺠Liquid-liquid structure transition (LLST) does occur in lead-free Sn-3.5%Ag solder. ⺠The increases of solid-liquid interface energy results in the melts need a larger undercooling to nucleate and a slower rate to grow when the melt experiences LLST. ⺠The solidification microstructures of Sn-3.5%Ag alloy are refined when the melt experiences LLST. ⺠When LLST occurs, the eutectic growth pattern would be changed.
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Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Xiaoyun Li, Fangqiu Zu, Wenlong Gao, Xiao Cui, Lifang Wang, Guohua Ding,