Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5358784 | Applied Surface Science | 2009 | 4 Pages |
Abstract
This paper focuses on the important process parameters required to control the quantity of incorporated copper in the layer, particularly the metalorganic concentration and the sputtering current. The dispersion of copper vs. the thin film thickness is found to be homogeneous. The deposited layers show antimicrobial activity for copper contents higher than XÂ =Â 38%, where XÂ =Â [Cu]/([Cu]Â +Â [Si]).
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
A. Daniel, C. Le Pen, C. Archambeau, F. Reniers,