Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5359268 | Applied Surface Science | 2011 | 5 Pages |
Abstract
In this study, polyamide 6 films were treated with different jet-to-substrate distances to investigate how it influenced the etching effect of plasma treatment. When the samples were too close or too far from the nozzle, the etching rate was almost not measurable. When the distance was 2Â mm, the etching rate was larger than that of other distance. Decrease in contact angle was observed under 2Â mm or 3Â mm of jet-to-substrate distance. However, the contact angle had no change when jet-to-substrate distance was 1Â mm or 6Â mm. It can be seen that the peel strength increased when jet-to-substrate distance was 2Â mm or 3Â mm, and the peel strength was the largest when jet-to-substrate distance was 2Â mm. However, the peel strength had no change when jet-to-substrate distance was 1Â mm or 6Â mm. These results were corresponding to SEM and XPS results.
Keywords
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Zhiqiang Gao,