Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5359326 | Applied Surface Science | 2011 | 7 Pages |
Abstract
ⶠThe actions of the ultrasonic and silica abrasive particles were the main factors in the sapphire material removal rate (MMR). ⶠThe chemical additives were helpful to decrease the roughness of sapphire. ⶠThe effects of the flexural vibration on the interaction between the silica abrasive particles, pad and sapphire substrate improved the sapphire's MRR.
Related Topics
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Authors
Wenhu Xu, Xinchun Lu, Guoshun Pan, Yuanzhong Lei, Jianbin Luo,