Article ID Journal Published Year Pages File Type
5360672 Applied Surface Science 2013 5 Pages PDF
Abstract
► A low-temperature insertion bonding method based on Cu-Ni cones was studied. ► Cu-Ni cones inserted into solder and a thin intermetallic compound layer formed. ► Bonding joint strength obtained here is comparable to that of reflow soldering.
Keywords
Related Topics
Physical Sciences and Engineering Chemistry Physical and Theoretical Chemistry
Preview
Low-temperature solid state bonding method based on surface Cu-Ni alloying microcones
Authors
, , , , ,