Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5360672 | Applied Surface Science | 2013 | 5 Pages |
Abstract
⺠A low-temperature insertion bonding method based on Cu-Ni cones was studied. ⺠Cu-Ni cones inserted into solder and a thin intermetallic compound layer formed. ⺠Bonding joint strength obtained here is comparable to that of reflow soldering.
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Qin Lu, Zhuo Chen, Wenjing Zhang, Anmin Hu, Ming Li,