| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5361063 | Applied Surface Science | 2008 | 5 Pages |
Abstract
KaptonFN film consists of a polyimide core that has been laminated with FEP fluoropolymer outer layers. This composite material's resistance to most chemical solvents, heat sealability and low moisture uptake make KaptonFN attractive as a packaging material for electronics and implantable devices. KaptonFN/Ti micro-joints were fabricated by using focused infrared laser irradiation. The micro-joints were mechanically debonded, and the KaptonFN/Ti interfaces were studied by using X-ray photoelectron spectroscopy (XPS). The locus of failure of the joints was found to be in the FEP layer near the interface with the Ti. The XPS results give evidence for the formation of TiF bond in the interfacial region.
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Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Grigor L. Georgiev, Taslema Sultana, Ronald J. Baird, Gregory Auner, Golam Newaz, Rahul Patwa, Hans Herfurth,