| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5361770 | Applied Surface Science | 2012 | 9 Pages |
Abstract
⺠We investigate the effect of polishing pad on the scratch formation during CMP. ⺠Both systematic experiment and computational simulation are used. ⺠The material properties of a pad change during CMP process. ⺠We first reveal the formation mechanism of pad-particle mixture during CMP. ⺠Pad-particle mixture is one of the major factors leading to scratch generation.
Keywords
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
In-Ha Sung, Hong Jin Kim, Chang Dong Yeo,