| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5361808 | Applied Surface Science | 2011 | 8 Pages |
Abstract
⺠A correlation between Cu oxide thickness and wetting angle was established. ⺠It was found that the wetting is acceptable only when the Cu oxides are under 16 nm. ⺠Surfaces coated with Organic Solderability Preservatives (OSP) were also studied. ⺠Oxidation of surfaces coated with OSP takes place under the organic layer. ⺠The determined activation energy for the OSP thermal decomposition is 32.6 kJ/mol.
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Authors
Mauricio Ramirez, Lothar Henneken, Sannakaisa Virtanen,