Article ID Journal Published Year Pages File Type
5362045 Applied Surface Science 2009 5 Pages PDF
Abstract
An indirect laser-induced method for selective removal of large copper areas from a printed circuit board is theoretically and experimentally investigated. The results show that the threshold condition for the process involves phase transition of the epoxy-based substrate resin. Optimal parameters for maximizing process speed are found and discussed.
Keywords
Related Topics
Physical Sciences and Engineering Chemistry Physical and Theoretical Chemistry
Preview
High-speed energy efficient selective removal of large area copper layer by laser induced delamination
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