| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5362152 | Applied Surface Science | 2012 | 6 Pages |
Abstract
⺠5 nm thick RuCr alloy is developed as a Cu diffusion barrier layer. ⺠RuCr film reveals a glassy microstructure and exhibits high thermal stability. ⺠RuCr film shows great barrier performance against Cu diffusion up to 650 °C.
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Kuo-Chung Hsu, Dung-Ching Perng, Jia-Bin Yeh, Yi-Chun Wang,