| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5362222 | Applied Surface Science | 2012 | 8 Pages |
Abstract
⺠A multiscale method is employed to study nanoindentation and nanoscratch processes of single crystal copper film. ⺠Load-depth curves obtained from both multiscale and full MD simulations match each other reasonably well. ⺠Indentation velocity has a great effect on the load-depth curve and hardness of single crystal copper film. ⺠The system size can be greatly expanded using the multiscale method without increasing computational cost.
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Authors
Pengzhe Zhu, Yuanzhong Hu, Fengzhou Fang, Hui Wang,