Ion beam nanoscale fabrication and lithography-A review

This review discusses some of the issues that will govern future commercial adoption of ion beam nanoscale fabrication and lithography, with special reference to some major fields of application. Selected recent research advances are highlighted, as they indicate new experimental successes, new insights into complex ion interaction mechanisms, and a fast evolving variety of advanced instrumentation and fabrication resources. It is evident that robust fabrication involving few-nanometer features will be enabled by strategic applications of ion beams, especially if they can be coupled with directed self-assembly.

► Ion beam lithography and patterning yield few-nanometer features with no proximity effect. ► Ion beam litho meets criteria for commercial adoption, e.g. CMOS beyond 22 nm node. ► Feature edge roughness due to shot noise is overcome by guided self-assembly. ► Focused (∼1 nm) beam patterns surfaces and seeds growth of 7 nm diameter pillars. ► Throughput demands may be met using self-assembly and implant defect engineering.