Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
5362626 | Applied Surface Science | 2013 | 8 Pages |
Abstract
A novel palladium-free surface activation process for electroless nickel plating was developed. Notably, this method applies a semi-Interpenetrating Polymer Network (semi-IPN) hydrogel film to modify the poly(vinyl chloride) (PVC) surface by chemical bonds. The hydrogel layer was used as the chemisorption sites for nickel, and the catalyst could successfully initiate the electroless nickel plating onto the PVC surface.
Related Topics
Physical Sciences and Engineering
Chemistry
Physical and Theoretical Chemistry
Authors
Ming-Qiu Wang, Jun Yan, Shi-Guo Du, Hong-Guang Li,