| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5362901 | Applied Surface Science | 2011 | 8 Pages |
Abstract
⺠2D nanoindentation in copper film investigated using new multiscale model. ⺠Load versus displacement graph shows only slight variation with MD model. ⺠Model ensures first-order compatibility and reduces computational time by one order.
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Authors
T.Y. Ng, Venkataraman Pandurangan, Hua Li,