Micropatterning and transferring of polymeric semiconductor thin films by hot lift-off and polymer bonding lithography in fabrication of organic field effect transistors (OFETs) on flexible substrate

Micropatterning and transferring of polymeric semiconductor thin films by hot lift-off and polymer bonding lithography in fabrication of OFETs with polymeric dielectric on the flexible substrate was proposed. The desired polymeric semiconductor patterns were fabricated on the flat polydimethylsiloxane (PDMS) surface with a selective lift-off method we proposed previously. The isolated and well defined polymeric semiconductor patterns left on the flat PDMS surface can be further transferred to the gate polymeric dielectric surface by polymer bonding lithography due to the low interfacial energy of PDMS. The transistor fabricated with this 'dry' process has a higher field-effect mobility compared with that using spin coated semiconductor layer.

► We introduced a micropatterning and transferring process uses mechanical adhesion as the patterning-driven-force. ► This process can be used to fabricate polymeric transistors on flexible substrate. ► The transistor has a higher mobility compared with that using spin coated semiconductor layer by avoiding the solvent effect.