| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 5363342 | Applied Surface Science | 2011 | 4 Pages |
Abstract
⺠Electroplating deposited NiW alloying films as diffusion barrier layers. ⺠The barrier performance of NiW films was improved with W atom blocked. ⺠Cu atom is hardly diffuse through NiW barrier layer. ⺠The stacked Si/Ni(W)/Cu films is perfect at 600 °C.
Related Topics
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Physical and Theoretical Chemistry
Authors
Yuhang Xin, Anmin Hu, Ming Li, Dali Mao,